Charlie Beebout, Program Manager at Global Circuit Innovations, will be presenting “Environmentally Hardening ICs Previously Assembled in Plastic Packages Through Die Removal, Bond Pad Re-plating and Reassembly into Hermetic Packages” … Read more

Erick Spory, CTO and President of Global Circuit Innovations, presented “Increasing High-Temperature Reliability of Plastic ICs Using Die Extraction, Gold Ball Removal, and ENEPIG Die Pad Plating (DEER™) at this … Read more

Global Circuit Innovations is pleased to announce that Program Manager Charlie Beebout has been selected to speak at this year’s IMAPS International Conference on High Temperature Electronics (HiTEC 2018). The … Read more

Charlie Beebout, Program Manager at Global Circuit Innovations, has been chosen to speak by the AA&S Review Committee at the 2018 Aircraft Airworthiness and Sustainment Conference to be held in … Read more

Erick Spory, CTO and President of Global Circuit Innovations, has been chosen to speak at this year’s 14th International Conference and Exhibition on DEVICE PACKAGING being held in Foothills, Arizona … Read more

Erick Spory, President and CTO of Global Circuit Innovations, has been invited to present “Advances in Die Extraction and Re-Packaging for Obsolete Semiconductors” to the French Afnor OBSO steering committee … Read more

Global Circuit Innovations is pleased to announce that the United States Patent Office awarded Patent #US 9,711,480 B2 for “Environmental Hardened Packaged Integrated Circuit” on July 18th, 2017. Erick Spory, … Read more

The United States Patent and Trademark Office issued Global Circuit Innovations the trademark for DER™ (Die Extraction and Reassembly/Repackaging) on May 30th, 2017, which incorporates several GCI proprietary integrated circuit … Read more

We are proud that GCI has once again achieved ISO 9001:2008 certification. The scope of this certification includes the die harvesting, pad reconditioning assembly, and sales of integrated circuits. The … Read more