GCI Engages with the Technical Community

GCI regularly presets at technical conferences and routinely publishes technical papers.

Global Circuit Innovations

Technical Papers

Integrated Circuit (IC) Die Extraction and Reassembly

Author: Erick Spory
Published on: 2020

 

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LRU, CCA, & IC Microcircuit Obsolesence Solutions without System Redesign

Author: Erick Spory
Published on: 2018

 

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Successful FPGA Obsolesence Form, Fit, and Function Solution Using a MCM and DER to Implement Original Logic Design

Author: Erick Spory
Published on: 2018

 

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Die Extraction And Reassembly Process

Author: Erick Spory
Published on: 2017

 

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A How-To Guide on Addressing and Resolving IC Obsolescence

Author: Charlie Beebout
Published on: 2017

 

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NSWC Crane & GCI: A DMSMS Case Study

Author: Erick Spory
Published on: 2016

 

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Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits

Author: Erick Spory
Published on: 2015

 

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Increasing High-Temperature Reliability of Plastic ICs Using DEER

Author: Erick Spory
Published on: 2015

 

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Frequently Asked Questions

FAQ

 
 

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