
GCI Engages with the Technical Community
GCI regularly presets at technical conferences and routinely publishes technical papers.
Global Circuit Innovations
Technical Papers

Integrated Circuit (IC) Die Extraction and Reassembly

LRU, CCA, & IC Microcircuit Obsolesence Solutions without System Redesign

Successful FPGA Obsolesence Form, Fit, and Function Solution Using a MCM and DER to Implement Original Logic Design

A How-To Guide on Addressing and Resolving IC Obsolescence

Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits

Increasing High-Temperature Reliability of Plastic ICs Using DEER