GCI Engages with the Technical Community
GCI regularly presets at technical conferences and routinely publishes technical papers.
Global Circuit Innovations
Technical Papers
Integrated Circuit (IC) Die Extraction and Reassembly
LRU, CCA, & IC Microcircuit Obsolesence Solutions without System Redesign
Successful FPGA Obsolesence Form, Fit, and Function Solution Using a MCM and DER to Implement Original Logic Design
A How-To Guide on Addressing and Resolving IC Obsolescence
Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits
Increasing High-Temperature Reliability of Plastic ICs Using DEER