Charlie Beebout, Program Manager at Global Circuit Innovations, will be presenting “Environmentally Hardening ICs Previously Assembled in Plastic Packages Through Die Removal, Bond Pad Re-plating and Reassembly into Hermetic Packages” at this year’s International Conference and Exhibition on High Temperature Electronics (HiTEC 2018) held in Albuquerque, New Mexico May 8-10th.
Mr. Beebout’s presentation is Tuesday, May 8th at 12:00 p.m.
HiTEC 2018 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2018 will be the forum for presenting leading high temperature electronics research results and application requirements.