U.S. Patent and Trademark Office issues Global Circuit Innovations Trademark

The United States Patent and Trademark Office issued Global Circuit Innovations the trademark for DER™ (Die Extraction and Reassembly/Repackaging) on May 30th, 2017, which incorporates several GCI proprietary integrated circuit technology flows.

Registration No. 5,215,549 Class 9: Electronic chips for the manufacture of integrated circuits.