Patent #US 9,711,480 B2 Awarded

Global Circuit Innovations is pleased to announce that the United States Patent Office awarded Patent #US 9,711,480 B2 for “Environmental Hardened Packaged Integrated Circuit” on July 18th, 2017.

Erick Spory, President and CTO of GCI “This patent represents the first granted of several submissions which eliminate Kirkendall Voiding for extracted IC’s (Integrated Circuits”) for very High Temperature applications using additive manufacturing processes”.