Erick Spory, CTO and President of Global Circuit Innovations, has been chosen to speak at this year’s 14th International Conference and Exhibition on DEVICE PACKAGING being held in Foothills, Arizona March 5th-8th 2018.
Mr. Spory will be presenting “Successful FPGA Obsolescence Form, Fit and Function Solution using a MCM and DER™ to Implement Original Logic Design”. There will be both an interactive poster discussion Wednesday, March 7th from 5:30-6:30 and a formal presentation on Thursday, March 8th at 11:15.
This is the Largest 2018 Conference Dedicated to:
Interposers, 3D IC & Packaging;
Fan-Out, Wafer Level Packaging & Flip Chip;
Engineered Micro Systems/Devices (including MEMS/Sensors…)