19 issued patents and counting

GCI’s innovations are recognized with 19 patents, 3 trademarks, and additional patents currently in process. These technological advancements set GCI apart from its competitors.

We continue to push the boundaries.

Global Circuit Innovations

Patents

Erick M. Spory

#9,966,319 – 8/21/11

Environmental Hardened Integrated Circuit Method and Apparatus

 

Patent number: 9,966,319
Issued on: 8/21/11

 

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Erick M. Spory

#8,466,371 – 6/18/13

Printed circuit board interconnecting structure with compliant cantilever interposers

 

Patent number: 8,466,371
Issued on: 6/18/13

 

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Erick M. Spory

#9,935,028 – 11/23/13

Method and Apparatus for Printing Integrated Circuit Bond Connections

Patent number: 9,935,028
Issued on: 11/23/13

 

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Erick M. Spory

#9,711,480 – 11/28/11

Environmental Hardened Integrated Circuit Method and Apparatus

 

Patent number: 9,711,480
Issued on: 11/28/11

 

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Erick M. Spory

#9,824,948 – 11/20/13

Integrated Circuit with Printed Bond Connections

 

Patent number: 9,824,948
Issued on: 11/20/13

 

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Erick M. Spory
Timothy M. Barry

#9,870,968 – 1/28/16

Repackaged Integrated Circuit and Assembly Method

Patent number: 9,870,968
Issued on: 1/28/16

 

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Erick M. Spory

#10,128,161 – 6/19/17

3D Printed Hermetic Package Assembly and Method

 

Patent number: 10,128,161
Issued on: 6/19/17

 

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Erick M. Spory

#10,177,056 – 1/28/16

Repackaged Integrated Circuit Assembly Method

 

Patent number: 10,177,056
Issued on: 1/28/16

 

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Erick M. Spory

#10,654,259 – 1/28/16

Conductive Diamond Application Method and System

 

Patent number: 10,654,259
Issued on: 1/28/16

 

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Erick M. Spory

#10,109,606 – 1/28/16

Remapped Packaged Extracted Die

 

Patent number: 10,109,606
Issued on: 1/28/16

 

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Erick M. Spory
Timothy M. Barry

#10,177,054 – 1/28/16

Method for Remapping a Packaged Extracted Die

 

Patent number: 10,177,054
Issued on: 1/28/16

 

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Erick M. Spory

#10,147,660 – 1/28/16

Repackaged Integrated Circuit with 3D Printed Bond Connections

 

Patent number: 10,147,660
Issued on: 1/28/16

 

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Erick M. Spory

#10,002,846 – 1/28/16

3D Printed Bond Connection Method for Repackaged Integrated Circuit

 

Patent number: 10,002,846
Issued on: 1/28/16

 

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Erick M. Spory

#10,460,326 – 1/28/16

IDD Signature

 

Patent number: 10,460,326
Issued on: 1/28/16

 

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Erick M. Spory

#10,431,510 – 10/3/17

Hermetic Lid Seal Method and Apparatus

 

Patent number: 10,431,510
Issued on: 10/3/17

 

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Erick M. Spory

#10,115,645 – 10/27/17

Repackaged Reconditioned Die Method and Assembly

 

Patent number: 10,115,645
Issued on: 10/27/17

 

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Erick M. Spory

#11,077,654 – 08/03/21

Conductive Diamond Application System

 

Patent number: 11,077,654
Issued on: 08/03/21

 

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Global Circuit Innovations

Trademarks

DER

#5,278,571 – 8/29/17

CLASS 37: Repair or Maintenance of Integrated Circuits Manufacturing Machines and Systems

 

Reg No.: 5,278,571
First Use: 6/15/10

 

DEER

#5,400,012 – 2/13/18

CLASS 9: Semiconductor Devices

 

Reg No.: 5,278,571
First Use: 11/1/13

 

DER

#5,215,549 – 5/30/17

CLASS 9: Electronic Chips for the Manufacture of Integrated Circuits

 

Reg No.: 5,215,549
First Use: 11/1/13