Advanced Thermal Management Systems

Current Immersion coolers are not compatible with standard electronic component packaging of ICs and CCAs. Long-term exposure of electronics to commonly used coolants, such as mineral oil, or water inevitably leads to damaged components. Non-reactive engineering fluids are available for a premium cost but do not have optimal heat transfer characteristics. Large data centers have begun implementing engineering fluids in both single-phase and two-phased immersion cooling for server racks, demonstrating a practical application of immersion cooling. GCI’s flexibility in both IC packaging material and form-factor allows for hermetically sealed, corrosion-resistant, high-reliability components that do not react with mineral oil or water. This unique capability allows GCI to pursue immersion cooling on a scale that is compatible with SWaP-C requirements.

Thermal 3D modeling with Ansys Software.

GCI uses Ansys software to generate simulations of prototypical architectures to inform design choices related to material selection, component geometry, and fluid flow. These simulations are verified through subsequent prototype fabrication and testing.

Ansys Temperature Modeling and Electrical Confirmation of Die Surface Temperature with Silicon PN Sensors

Thermal Heat Transfer Simulation.

Rendering for IC Package Fins within Immersion Cooler

Silicon chips generate heat in sub-optimal locations within an integrated circuit package. GCI’s current research aims to enhance omni-direction heat transfer by creating a “highway” from head-producing locations to the exterior of the package by augmenting the inner cavity of a typical package with highly thermally conductive diamond epoxy.

These drop-in replacement solutions for obsolete CCAs and microcircuits improve DoD system readiness, solving the DMSMS issues associated with lifecycle sustainment.

Thermal modeling of fins for power IC cooling requirements.